PACK EXPO International

Chicago, Illinois, United States • 14 – 17 October 2018

Visit our kiosk #N-5701 and booth #E-8043.


PACK EXPO International is the largest packaging trade show in the world in 2018. This show will bring together the solutions you need to launch a new product, solve production issues and keep your products competitive.

The event will enable you to see smart machine technology in action — spark your creativity by observing equipment at full scale, in action and in person — and examine multiple approaches to similar challenges.

Attending this event will also help you implement great ideas by experiencing broad trends, connecting with experts and identifying the best solution to meet your specific needs.

Plus, with so many smart machine solutions on display, you’re sure to find ways to apply new technology, achieve cost-saving efficiencies, or boost output in an unexpected way.

Register Today! Rockwell Automation customers receive free registration to the event. Use the registration button to access your complimentary registration.

Local Events

Dates

14 – 17 October 2018

Location

Chicago, Illinois, United States

INNOVATION STAGE PRESENTATIONS

Smart, Flexible Manufacturing

Sunday, October 14 at 2:00 p.m. CT

Join Steve Mulder, Rockwell Automation Packaging Segment Leader, to learn how innovative technologies are allowing more flexibility in manufacturing with a look at several use cases. Join the discussion on how business models are evolving to support changing market demands.

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Analytics for Delivering Business Value in Industrial IoT

Monday, October 15 at 2:00 p.m. CT

Is your data working for you? Join Sujeet Chand, Rockwell Automation Senior Vice President and CTO, for this session to learn how value can be gained when context is applied to business data and info is served up to the right location, making your operations more productive overall.  Get a look at how today's technological developments are revolutionizing how industrial information is used across an enterprise.

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Cybersecurity in Manufacturing Operations

Tuesday, October 16 at 11:00 a.m. CT

Join this session presented by Anthony Baker, Rockwell Automation Cybersecurity Portfolio Manager, to learn about the recent cybersecurity attacks that have affected industries around the world and review the steps manufacturing organizations are taking to protect their businesses. Rockwell Automation will provide recommendations on best practices, and define actionable steps you can take with reference to the NIST Cybersecurity Framework and ISA/IEC 62443.

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Machine Profiles

See our solution in action around the event.

Read the machine profiles and then visit these stands to see the machines in action.

BRADMAN LAKE: S-2944 / Bread Bagging Machine

CAMA USA: S-2894 / IF316 | Triaflex Parallel Kinematics Robot

CAVANNA PACKAGING USA: S-1614 / SLIM flow-wrapping machine | Slim and Carteasy Line Wrapping Solution

CT PACK: E-7352 / All-In-One Packaging Machine

DARA: W-703 / HSL-PP/4 automatic infeed, filling and closing of injection vials machine

ILAPAK: S-3783 / Carrera 500Vegatronic 6000 SD

LIVE-TECH: E-10548

MARDEN EDWARDS: E-8240

MESPACK PACKAGING MACHINERY: S-2147 / H-540-FE6 is a rugged and reliable machine

PFM AMERICA: S-2554 / PFM D-Series Stand-Up Pouch Machine

RAPAK-DS SMITH: N-5562

ROBOPAC: N-4736 / Genesis Thunder Machine

SOMIC AMERICA: E-8550 / FLEXX III

VIKING MASEK GLOBAL PACKAGING TECHNOLOGIES: S-2852 / VFFS M250 intermittent motion packaging machine | ST800 is a versatile high speed, multi-lane stickpack machine

Rockwell Automation PartnerNetwork™

Rockwell Automation PartnerNetwork™

Learn more about our innovative machine and equipment builders that will be exhibiting PACK EXPO!

PACK GIVES BACK NETWORKING EVENT

Rockwell Automation is the title sponsor for this year’s Pack Gives Back Event.

Join colleagues for an evening of great comedy for a good cause at the PACK gives BACK™ networking reception and performance by comedian Sebastian Maniscalco.

Proceeds from the event will benefit the PACK EXPO Scholarship program to support students studying packaging and processing at PMMI partner schools—universities and colleges with packaging and processing programs.

Location

McCormick Place

2301 S King Drive
Chicago, IL 60616
United States

McCormick Place is the largest convention center in North America. It consists of four interconnected buildings and one indoor arena sited on and near the shore of Lake Michigan, about 2 mi south of downtown Chicago, Illinois, United States. 

REGISTER TODAY!

Rockwell Automation customers receive free registration to the event. Click here to access your complimentary registration.