Enhance Connectivity in Harsh Applications via IO-Link I/O and EtherNet/IP™ I/O Blocks

Enhance Connectivity in Harsh Applications
On-Demand

Duration

60 Minutes

Language

English

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Today’s trend is all about machines working smart with better connectivity and improved productivity, even so in harsh applications. The ArmorBlock® EtherNet/IP™ I/O and IO-Link blocks built-in nickel-plated zinc die-cast housing works well in harsh operating temperatures -20…+70° C (-4…+158° F) to achieve that goal. Users can mount these modules on a machine close to the sensors and actuators to provide shorter cable runs for automotive, material handling, packaging and welding applications. The modular design provides optimization and allows more field devices to be connected to machine applications. With enhanced diagnostics, users can improve uptime and reduce time spent on commissioning and troubleshooting.

Key Takeaways:

  • Reducing design time with flexibility offered by ArmorBlock® IO-Link I/O and EtherNet/IP™ I/O blocks
  • Get access to real-time performance data to improve uptime and increase productivity
  • Reducing wiring costs while increasing more field device connections
Mingjing Ye
Presented by Mingjing Ye, Product Manager, Rockwell Automation

Mingjing Ye is the Product Manager for ArmorBlock® I/O. He has worked in industrial automation for more than 12 years in various roles such as product manager and programmable logic controller (PLC) programmer. Mingjing received his Bachelor’s degree in Electrical and Electronics from Nanyang Technological University and Master of Science degree in Electrical and Computer Engineering from National University of Singapore. Additionally, he is a TÜV Certified Functional Safety Engineer in Machinery.

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