Our Bulletin 1715 Redundant I/O modules provide true redundant I/O support for critical process applications in standard and extreme operating environments. With exceptional ease-of-use, premier diagnostics, and flexible configuration, these modules support fault tolerant capabilities without requiring additional hardware or software.
Our FLEX 5000™ I/O modules are a rugged and flexible distributed I/O solution, which allows you to choose your I/O to meet your operational needs. FLEX 5000 I/O enhances communication with 1 Gb EtherNet/IP™ connectivity, which offers higher speed and increased bandwidth. To provide flexibility in your network architecture, these modules includes 2 copper or 2 fiber ports (SFP) and support for DLR, Star, Linear, and PRP topologies.
Our Bulletin 1794 FLEX™ I/O modules offer flexibility for your application with digital, analog, HART analog, and specialty I/O, with 4…32 points per module. You can mix and match digital and analog I/O with mounting and wiring options.
Our Bulletin 1734 POINT I/O™ modules are ideal for applications that require flexibility and low cost of ownership. Granularity of one to eight points lets you buy only the I/O you need. The compact design makes installation easier in limited panel space. The family includes POINT Guard I/O™ safety-rated I/O modules that can be used side-by-side in a standard POINT I/O system. Network connectivity includes ControlNet™, DeviceNet™, EtherNet/IP™, and other open networks. Some modules feature DeviceLogix™ Smart Component Technology, integrating low-cost logic solving capability in your I/O for faster sense-to-actuation times.
Our Bulletin 1719 Ex I/O modules are an intrinsically safe distributed I/O platform that can be mounted in Zone 2 or Class I, Div 2. This platform integrates devices in hazardous areas via EtherNet/IP™ in a chassis-based I/O design that provides maximum efficiency in a small space.
Our Bulletin 1718 Ex I/O modules are an intrinsically safe distributed I/O platform designed for Zone 1 hazardous areas, when placed in certified enclosures. This platform integrates field devices via EtherNet/IP™ in a compact, chassis-based I/O design.The form factor provides maximum efficiency and reduces the need for additional hardware and wiring.