Terminology

Power that is generated from module power by the adapter and expansion power, and supplied to the I/O system through the backplane.

An industrial communication protocol that is used by Logix 5000® based automation systems on EtherNet/IP™, ControlNet®, and DeviceNet® communication networks.

CIP Sync provides the increased control coordination needed for control applications where absolute time synchronization is vital to achieve real-time synchronization between distributed intelligent devices and systems.

A device that is used in thermocouple measurements to help obtain accurate temperature readings at the hot junction.

A device that provides data and power connections from the backplane to the installed module.

Power that is supplied to the adapter and expansion power.

A nonprofit association of vendors that are established for the promotion of CIP networks.

A feature that enables the device to be connected and disconnected from the system without having to remove power from the system.

Time interval (usually in milliseconds) that users are requesting their data be exchanged at

A component that is used for wiring field devices to.

A type of sensor whose resistances change as its temperature changes.

Sensor Actuator Power (24V DC nominal) for the field devices.

An electrical system where the voltage level is considered safe under normal or fault conditions, as defined in the EN and IEC standards.

A thermocouple is a device that measures temperature by joining two different metal wires at one end. When the junction between the wires heats or cools, it generates a voltage that can be measured. This voltage can be translated into a temperature reading.

Modules with XT at the end of their catalog numbers have design considerations and conformal coating that add a degree of protection for harsh, corrosive gas environments.