Terminology
This table defines the terms that are used in this publication.
Acronym | Full Term | Definition |
|---|---|---|
BP | Backplane Power | Power that is generated from module power by the adapter and expansion power, and
supplied to the I/O system through the backplane. |
CIP™ | Common Industrial Protocol | An industrial communication protocol that is used by Logix 5000® based automation
systems on EtherNet/IP™, ControlNet®, and DeviceNet® communication networks. |
CIP Sync™ | Common Industrial Protocol Synchronization | CIP Sync provides the increased control coordination needed for control
applications where absolute time synchronization is vital to achieve real-time
synchronization between distributed intelligent devices and systems. |
MB | Mounting Base | A device that provides data and power connections from the backplane to the
installed module. |
MP | Module Power | Power that is supplied to the adapter and expansion power. |
MTO | Motor Torque Off | A motor control function that disables torque generation by removing
torque-producing drive output from the motor. |
RIUP | Removal and Insertion Under Power | A feature that enables the device to be connected and disconnected from the
system without having to remove power from the system. |
RPI | Requested Packet Interval | Time interval (usually in milliseconds) that users are requesting their data be
exchanged at |
RTB | Removable Terminal Block | A component that is used for wiring field devices to. |
SA | Sensor Actuator - Power | Sensor Actuator Power (24V DC nominal) for the field devices. |
XT | Extreme Environment | Modules with XT at the end of their catalog numbers have design considerations
and conformal coating that add a degree of protection for harsh, corrosive gas
environments. |
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