Rockwell Automation, the world’s largest company dedicated to industrial automation and digital transformation, today announced it will showcase a joint digital factory and production line demonstration at Interpack 2026, May 7–13 in Düsseldorf, Germany. The demonstration will be presented in collaboration with Eplan, a leading provider of software for electrical and automation engineering, and autonox, a specialist in flexible and controller‑independent robot mechanics.
Manufacturers face growing pressure to break down siloed engineering, remove fragmented data and replace rigid automation that limits flexibility and slows time to market. By bringing together digital engineering, automation and robotics, the approach shows how standardized data, digital twins and modular architectures help manufacturers commission lines faster, improve performance and scale future-ready packaging operations across both processing and packaging environments.
“Food, beverage and consumer goods manufacturers are navigating growing operational complexity, from customization and regulatory compliance to workforce challenges and sustainability pressures,” said Fabrizio Scovenna, regional vice president OEM for Europe, Middle East and Africa, Rockwell Automation. “By working closely with Eplan and autonox, we are showing how integrated digital engineering, automation and robotics can help manufacturers and OEMs reduce risk, accelerate time to market and build production systems that are ready for continuous change.”
As part of Rockwell Automation’s PartnerNetwork™ ecosystem, the demonstration brings together Rockwell Automation, autonox and Eplan to showcase how open, interoperable collaborations enable a connected engineering to operations workflow. It combines Rockwell’s control, motion and Emulate3D™ digital twin technologies with Eplan’s electrical engineering solutions, alongside Rittal enclosures, creating a seamless digital thread from design through operation. This approach helps OEMs streamline machine design, improve collaboration across engineering disciplines and maintain consistency between virtual models and real-world production systems.
“Interpack is an ideal platform to show how consistent, structured engineering data can unlock efficiency across the entire lifecycle of packaging machinery,” said Simon Budde, head of partner management at Eplan. “Together with Rockwell and autonox, we are showing how digital engineering and automation can work hand in hand to simplify complexity for machine builders and end users alike.”
autonox contributes advanced robot components demonstrating how flexible automation can be integrated into modern packaging lines. The joint demo illustrates how robot kinematics and high-performance motion control enable adaptable layouts, customized packaging formats and efficient end-of-line operations without sacrificing reliability or throughput.
“At autonox, we believe in robotics built from components provided by specialized partners that combine flexibility with industrial robustness,” said Clemens Ratajczak, head of operations at autonox. “This collaboration shows how close alignment with automation and engineering partners enables smarter, more responsive packaging systems tailored to the demands of the food, beverage and CPG industries.”
Visitors interested in exploring Rockwell's technologies and those of its PartnerNetwork ecosystem at Interpack 2026 can find more information online and plan their visit to the company’s location in hall 6, booth C40.
