Test Engineering Systems
In-Circuit Test (ICT)
In-Circuit Test (ICT) is a method of test where components on a circuit board are isolated and individually tested. This is done primarily to gain feedback on production processes (i.e. – shorts, opens, missing components, damaged components, mis-oriented components and wrong type components). A secondary aspect of ICT is to perform more advanced types of tests such as functional testing, pseudo-functional testing, device programming and board calibration.
A unique Bed-Of-Nails fixture and program are required for each bare board type. Full nodal access of a board is preferred in order to achieve the maximum benefits of this test method. ICT is usually performed near the end of the circuit board manufacturing process. The lead time for a production ready ICT fixture with software is generally 6 weeks from circuit board design release, but can be adjusted accordingly based on your needs.
Rockwell Automation Test Engineering Systems has provided reliable, quick-turn, and cutting-edge global test solutions for the past 14 years internally and the last 3 years externally at an exceptional price.
To learn more about Rockwell Automation Test Engineering Systems, click here to view the brochure RA ICT Provides Agilent In-Circuit Test Solutions.