Industry Solutions

Semiconductor Packaging

Semiconductor packaging applications require several important precision motion steps — from wafer dicing, chip scale and wafer-level packages, multi-chip module assembly, die sorting, die bonding, and final package lead inspection. Anorad's multi-axis motion control expertise using linear motor based precision gantry and positioning stage products can help you overcome your motion control hurdles to deliver highly repeatable and highly reliable electronic package positioning solutions.

Examples of Anorad's IC Packaging Solutions

Outer Lead Fine Pitch Bonder

• Places TAB, COB, BGA, SMD, QFD and custom devices
• Automatic placement of devices with up to 1024 leads and 100 um pitch
• Placement area of 450mm x 600mm
• Component alignment to better than 5um, 3s

Die Bonder Gantry

• Machine vision system integrated with gantry for pick-inspect-bond-place applications
• Complete Automation solution includes
  
  • 4-axis motion system
  • Electronic Controls
  • Enclosure & base all integrated on welded steel machine frame

Inner Lead TAB Bonder

• Automatic placement of devices with up to 1024 leads and 50 um pitch
• Die sizes from 2 x 2 to 25 x 25 mm
• 35 mm, 48 mm and 75 mm tape sizes in singulated or reel to reel format
• 3-sigma process accuracy is within 4 um