Engineered-to-Order Systems

Total Custom Stages

Outer Lead Fine Pitch Bonder

• Places TAB, COB, BGA, SMD, QFD and custom devices
• Automatic placement of devices with up to 1024 leads and 100 um pitch
• Placement area of 450mm x 600mm
• Component alignment to better than 5um, 3-sigma.

Welded Steel Frames

• Anorad can provide pre-engineered steel machine frames.
• Frames often supportprecision gantries and Anocast bases
• Provisions for rack-mountedelectronic control packages and machine subsystems

Inner Lead TAB Bonder

• Automatic placement of devices with up to 1024 leads and 50 um pitch
• Die sizes from 2 x 2 to 25 x 25 mm
• 35 mm, 48 mm and 75 mm tape sizes in singulated or reel to reel format
• 3-sigma process accuracy is within 4 um

X-ray Lithography

• Custom engineered positioning system for lithography research
• Mask/target alignment system using noncontact laser sensors
• Integrated robotic wafer handling
• Class 1 cleanroom compatible